FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Variable color temperature from 3

Variable color temperature from 3

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Wire Size AWG Max 14AWG Wire Connection Method Clamp Rated Current 18A No

Brand VISHAY Part Number PHP01206E2001BST3 Quantity Each (Supplied on Cut Tape) Technical Data Sheet EN

This petal-shaped hood features a ridged interior surface to further restrict unwanted light from reaching your lens and creating unwanted flare

FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Variable color temperature from 3The ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors. 1. 8mm Plate thickness Applications Industrial Product details External Diameter Metric Packages Cooled BGA, PLCC Heat Sink Material Aluminium Thermal Resistance 23C W External Length